Developing a complete ecosystem, by providing a full technical solution for ultra-wideband (UWB)-based services and full coverage of vertical services, means working with other consortia and industry stakeholders to develop approaches and define parameters. Many technologies complement UWB, such as NFC, Bluetooth®, and Wi-Fi, and adjacent markets leverage UWB in other ways, especially in the automotive domain/vertical which is specifically addressed by the Car Connectivity Consortium (CCC). We are committed to complementary cooperation with all these players.
FiRa Collaborations
The Car Connectivity Consortium® (CCC) is a cross-industry organization advancing technologies for smartphone-to-car connectivity solutions. The CCC represents the vast majority of the global automotive and smartphone industries, with over 170 member companies. The CCC member companies include smartphone and vehicle manufacturers, automotive tier-1 suppliers, silicon/chip vendors, and security product suppliers representing a comprehensive ecosystem for secure access.
Digital Key allows consumers to use their mobile devices, regardless of manufacturer or operating system type, to easily and securely access their vehicles. Based on the IEEE 802.15.4z standard, UWB secure ranging is a core technology that enables Digital Key 3.0. by preventing car theft while preserving full user convenience.
CCC and FiRa are committed to complementary collaboration as they share the same vision about the importance of interoperability to drive the development of a UWB ecosystem of devices.
The Connectivity Standards Alliance is the foundation and future of the Internet of Things (IoT). Established in 2002, its wide-ranging global membership collaborates to create and evolve universal open standards for the products transforming the way we live, work, and play. With its members’ deep and diverse expertise, robust certification programs, and a full suite of open IoT solutions, the Alliance is leading the movement toward a more intuitive, imaginative, and useful world.
These combined efforts enable both organizations to ensure a more cohesive development environment for UWB technologies. It’s a cooperative approach that not only encourages growth of UWB use cases, but also reduces development costs associated with multiple certifications.
EMVCo’s work helps make safe, reliable, and convenient payments possible anywhere in the world. As a global technical body, EMVCo collaborates with industry stakeholders to develop technical specifications and programs that any party can use to design payment products that will work seamlessly and securely worldwide.
UWB is widely used in hundreds of millions of smartphones and wearables. The built-in security measures make UWB a very attractive technology for security-critical applications such as payment systems. As such, FiRa and its members are collaborating with EMVCo to enable the implementation and deployment of UWB-enabled secure wireless payment systems.
FiRa is now a member of ETSI. With over 900 member organizations, ETSI produces globally applicable standards for ICT-enabled systems, applications and services deployed across all sectors of industry and society.
Membership in ETSI provides FiRa with the opportunity to be involved in drafting the Harmonized Standards that our members need to use to certify their devices. Membership also provides FiRa with the right to participate in other regulatory bodies in Europe, helping to ensure that European UWB regulations align with how UWB technology will be used.
IEEE is the world’s largest technical professional organization dedicated to advancing technology for the benefit of humanity.
FiRa’s journey toward developing a UWB-enabled ecosystem began with leveraging the IEEE standard 802.15.4 and the IEEE 802.15.4z Amendment 1. By supporting the IEEE’s work with an interoperable HRP standard, FiRa will be capable of developing service-specific protocols for multiple verticals and defining the necessary parameters for a wide-range of applications.
FiRa is Dedicated to Developing an Open Ecosystem
FiRa’s dedication to an open ecosystem means we welcome the contributions of every key stakeholder, from chip and device manufacturers to system integrators, service and technology providers, test tool developers, test labs, and academics. By collaborating across disciplines and leveraging industry standards where applicable, we create a stronger ecosystem for UWB technology as a whole.