CXSemi CX310 Chip

The CX310 is a fully integrated single chip impulse radio ultra-wideband (UWB) SoC chip with feature of low-power, high integration, high performance, high security, and is compliant to IEEE802.15.4a HRP, IEEE802.15.4z HRP, FiRa, CCC and ICCE. CX310 supports ranging, radar and data transmitting. With small packages of WLCSP60 (3.1mm*3.1mm) and QFN40 (5mm*5mm), CX310 is especially suitable for consumer applications, automotive electronics, IoT and industry applications.

Key Feature

  • IEEE802.15.4a HRP/IEEE802.15.4z HRP/FIRA/CCC/ICCE compliant
  • Supports 500M channel bandwidth from 6 GHz to 9 GHz (Channel 5,6,8,9,10)
  • Supports TWR, AOA, TOA, TDOA and PDOA 
  • Low external component count
  • ARM® Cortex-M33 32 bit processor
  • ARM® TrustZone technology and S-DMA for security
  • Supports AES, ECC, SHA, CRC and security interface
  • Complies with FCC & ETSI UWB spectral masks 
  • Maximum packet length of 1023 bytes for high data throughput applications 
  • Low power consumption design
  • Data rates of 850 kbps, 6.81 Mbps, 7.8Mbps, 27.24Mbps and 31.2Mbps
  • Integrated MAC support features 
  • Supports SPI(Master/Slave)/UART/I2C/JTAG/SWD/Can interface
  • Supports ROM, OTP and SRAM
  • Dynamic programmable transmitter output power
  • Integrated LDO, integrated RF frontend and matching network
  • Supports automatic calibration
  • Supports system clock or external crystal
  • 3.1mm*3.1 mm WLCSP 60 Pin package and 5mm*5mm QFN 40 Pin package
  • TSMC 28nm

Key Benefits

  • Fully coherent receiver for maximum range and accuracy 
  • Asset location to an accuracy of 5cm
  • High integration supports smallest customer rBOM
  • Integrated LDO, integrated RF frontend and matching network
  • Supports automatic calibration
  • Supports system clock or external crystal
  • Small package: 3.1mm*3.1 mm WLCSP and 5mm*5mm QFN package

Applications

  • Supports ranging, radar and data transmitting
  • Supports TWR, AOA, TOA, TDOA and PDOA 
  • Supports radar:
    • Sentinel radar
    • Breath test
    • Kicking radar
    • Child Presence Detection
  • Suitable for a variety of markets:
    • Consumer
    • Automotive electronics
    • IoT 
    • Industrial

Underlying FiRa Certification

  • FiRa Certified Chip(s) Used:
    CX310
  • Member Profile(s):
    CXSemi

Additional Documentation

CXSemi_CX310_CX310 Brief Spec.pdf (443.99 KB)

Contacts

marketing@cxsemi.net